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Spherical Silica Powder
Spherical Silica Powder
Spherical particles prepared by special process, featuring high sphericity, excellent fluidity and high filling rate. Can significantly reduce the viscosity of epoxy molding compounds and improve packaging reliability.
Specifications
| SiO₂ Content | ≥99.9% |
|---|---|
| Sphericity | ≥95% |
| Particle Size (D50) | 1-20μm |
| Whiteness | ≥90 |
| Density | 2.2 g/cm³ |
| Dielectric Constant | 3.7 |
| Thermal Expansion | 0.5×10⁻⁶/℃ |
| Metal Impurity | <10ppm |
| Moisture | ≤0.1% |
| Loss on Ignition | ≤0.15% |
Product Models & Specifications
| Model | Mesh | D50 | Purity | Applications |
|---|---|---|---|---|
| SS-10 | — | 10 μm | ≥99.5% | General PurposeCopper Clad Laminates (CCL) |
| SS-5 | — | 5 μm | ≥99.5% | Copper Clad Laminates (CCL)Epoxy Molding Compound |
| SS-3 | — | 3 μm | ≥99.5% | Epoxy Molding CompoundElectronic Packaging |
| SS-2 | — | 2 μm | ≥99.5% | Low ExpansionSemiconductor Packaging |
Applications
Electronic Packaging
Adhesives
Photovoltaics