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Fused Silica Powder
Fused Silica Powder
Made from high-purity quartz through high-temperature melting and fine grinding. Features extremely low thermal expansion, excellent electrical insulation and low internal stress. Ideal filler for electronic packaging and high-end coatings.
Specifications
| SiO₂ Content | ≥99.9% |
|---|---|
| Whiteness | ≥90 |
| Particle Size (D50) | 2-30μm |
| Thermal Expansion | 0.5×10⁻⁶/℃ |
| Electrical Insulation | Excellent |
| Density | 2.2 g/cm³ |
| Mohs Hardness | 5.5 |
| Dielectric Constant | 3.8 |
| Moisture | ≤0.1% |
| Loss on Ignition | ≤0.2% |
Product Models & Specifications
| Model | Mesh | D50 | Purity | Applications |
|---|---|---|---|---|
| FS-200 | 200 mesh | — | ≥99.9% | Investment CastingShell Molds |
| FS-325 | 325 mesh | ~44 μm | ≥99.9% | General PurposeCoatings |
| FS-1250 | 1250 mesh | ~10 μm | ≥99.9% | Low ExpansionElectronic Packaging |
| FS-3000 | 3000 mesh | 3-5 μm | ≥99.95% | Semiconductor PackagingElectronic Packaging |
| FS-5000 | 5000 mesh | 1-3 μm | ≥99.98% | MicronizedSemiconductor Packaging |
Applications
Electronic Packaging
Coatings
Adhesives
Precision Casting